Socket for radio tubes or the like



July 3, 1956 s. OFFERMAN SOCKET FOR RADIO TUBES OR THE LIKE Filed Aug. 16, 1952 Ti [:1 1D

INVENTO SEYMOUZ OFF-'5? N BY a o ATTORNEYS SUCKET FOR RADIO TUBES OR THE LIKE Seymour Ofterman, Great Neck, N. Y., assignor to Industrial Hardware Mfg. Co., Inc., New York, N. Y., a corporation of New York Application August 16, 1952, Serial No. 304,779

Claims. (Cl. 339-194) This invention relates to sockets for multiple prong connectors, and more particularly for radio tubes, television tubes, or the like.

Radio tube sockets sometimes employ molded insulation bases of complex configuration, and sometimes employ wafers of sheet insulation which are secured together with parts of metal contacts anchored therebetween. The latter sockets are commonly known as laminated sockets.

The primary object of the present invention is to simplify the laminated type socket by providing a satisfactory socket using only a single layer or wafer of insulation, with the metal contacts satisfactorily secured to this single wafer.

A more particular object of the invention is to provide such a socket adapted for use with miniature tubes despite the close spacing of the prongs of such tubes.

Still another object of the invention is to provide a modified form of my improved socket intended and adapted for use with so-called printed circuits.

To accomplish the foregoing general objects, and other more specific objects which will hereinafter appear, my invention resides in the socket elements, and their relation one to another, as are hereinafter more particularly described in the following specification. The specification is accompanied by a drawing, in which:

Fig. 1 is a bottom view of the socket;

Fig. 2 is a top view of the socket;

Fig. 3 shows the blank for the metal contact, drawn to enlarged scale;

Fig. 4 is a similar view showing a later stage in the manufacture of the contact;

Fig. 5 is a similar view, but showing the relation of the parts when a tube prong is inserted in the contact;

Fig. 6 is a similar view, but showing a modification for use with printed circuits;

Fig. 7 is a side elevation of the contact shown in Fig. 4 after the same has been bent preparatory to insertion in the insulation base;

Fig. 8 is a section taken approximately in the plane of the line 88 of Fig. 2, but drawn to enlarged scale;

Fig. 9 is a section generally similar to Fig. 8, but show ing a modification for use with printed circuits; and

Fig. 10 is a plan view of the modified socket.

Referring to the drawing, and more particularly to Figs. 1 and 2, the socket comprises a single lamination or wafer 12 stamped out of sheet insulation. Usually a thermosetting resin is employed, for example, a phenolic such as Bakelite. In the present case the wafer 12 has a somewhat diamond-shaped configuration which is now fairly conventional and which provides a pair of projecting ears 14 perforated at 16 to receive eyelets or the like for mounting the socket on a chassis. In the'present case the socket is a miniature socket intended for use with a miniature tube having seven prongs. These are disposed at an angle of forty-five degrees, or, in other words, at the spacing for eight prongs, but one prong is omitted, thus properly orienting the tube in relation to the socket.

" l nited States Patent 0 i ice In Figs. 1, 2 and 10 the drawing has been simplified by omitting most of the contacts, but it will be understood that the contacts are all alike and are arranged in a circle and extend radially thereof.

Referring now to Fig. 7, it will be seen that the contact comprises a top portion 20 which is extended at one end to provide a soldering lug 22 which may be of generally conventional dimension. The contact is also extended at the other end to provide an anchoring tab 24, this tab being bent downwardly from the top portion. The length of the tab is suflicient to pass through the single wafer 12 with its tip adapted to be bent beneath the wafer. Thus referring to Fig. 8 of the drawing, the contact has been inserted through the wafer 12, and the tip 26 of tab 24 has been bent outwardly of the socket. At the same time the portion of the soldering lug 22 immediately below wafer 12 has been reversely bent or indented inwardly of the socket, as shown at 28. Thus the contact is securely anchored on the wafer 12, even though only a single wafer is employed.

Referring now to Fig. 3 of the drawing, the metal blank 30 is shaped to provide the top portion 20, the soldering lug 22, and the tab 24 of the contact. It will be noted that the tab has a width which is only a fraction of the width of the lug 22. This reduced width is sufiicient for strength or anchoring purposes, and is important in order to maintain clearance between adjacent contacts when they are arranged in a ring in the socket. This will be clear from inspection of Figs. 1 and 2, for it will be seen that the wafer 12 is provided with three concentric rings of holes 62, 64, and 66. The radius of the intermediate ring of holes 64 is fixed, for it corresponds to the radius of the ring of prongs of the miniature radio tube which is tobe received by the socket. The holes or elongated slots 66 which receive the lugs 22 are disposed on a larger radius, this providing room for the lugs, despite their width. However, the holes 62 which receive the tabs 24 are necessarily disposed on a smaller radius, thus reducing the arcuate spacing between the tabs. In order to maintain adequate electrical clearance between the contacts, and adequate physical strength for the wafer 12, the tabs 24 are greatly narrowed, as indicated in Fig. 3.

The top portion 20 of the contact is, of course, provided with means to receive the radio tube pin. Referring to Fig. 4 there is a hole 32 to receive the pin, a slot 34 spaced toward the lug 22, and another slot 36 spaced toward the tab 24. A slit 38 is provided running longitudinally of the contact between the slots 34 and 36, and preferably diametrically of the hole 32. This hole 32 is small enough to receive the tube pin with a resilient fit, and expansion is afforded by the slotted and slit construction described.

Thus, referring to Fig. 5, the relation of the parts is shown after insertion of a tube pin, the tube pin being indicated in cross-section at it). it will be seen that the sides of the opening have been spread apart somewhat, as indicated by the deformation or spreading at the slits 38 and the deformation of the slots 34, 35.

In Figs. 7 and 8 it will be seen that the hole 32 is pro-- vided with a flange 42. This is provided by drawing or bending the metal downward when forming the hole. Thus in Fig. 3 the blank has a slit at 3-93, and material is actually punched away to form the slots 34 and 35, but material is not punched away at the location of the hole 32. Instead the material is retained but is sub-- sequently bent, shaped, or drawn downward to provide a skirt or flange around the hole, thus providing a better surfacefor engagement with the radio tube pin.

In practice the metal contacts are preferably stamped and shaped in a suitable progressive die to reach the generally U-shaped form shown in Fig. 7. The wafers are stamped from sheet insulation and are provided with the three rings of perforations, and the end perforations 16. The assembly consists in loading each wafer with seven of the contacts, following which a suitable die is employed to bend the tip of tab 24 outward, and the upper part of lug 22 inward, as shown at 26 and 28 in Fig. 8.

A modified form of my new socket, intended and adapted for use with printed circuits, may be described with reference to Figs. 6, 9 and of the drawing. In this form of the invention the soldering lug 44 is not bent downward, and instead extends out radially generally in the plane of the wafer 46. The lug 44 may be like that previously described, except that there is no need to provide perforations therein to receive the end of a wire. The wafer 46 may be like that previously described, except that the outermost of the three rings of holes is provided with small holes 68 to receive a tab, instead of relatively long slots or holes to receive soldering lugs.

Referring now to Fig. 6, the blank 48 for the contact is generally like that previously described, except that a tongue 50 is excised and later stamped downwardly free of the lug 44. This tongue 50 has a length generally comparable to the tab 52 and is used in much the same way, as will be seen by reference to Fig. 9. The tongue 50 and the tab 52 pass downwardly through mating apertures in the wafer, and the tips 54 and 56 are bent toward one another or clenched beneath the wafer 46, thereby anchoring the contact on the wafer.

It will be understood that Fig. 10 has been simplified, and that in practice there Would be seven contacts disposed at an angle of forty-five degrees, or at the spacing for eight contacts, with one contact omitted for proper orientation of the tube. It will also be noted and understood that the lugs .4 extend radially beyond the periphery of the base or wafer 46. This is to permit soldering of the ends to printed circuitry. More specifically, the conductors of the circuit leading to the socket are printed on the underside of an insulation plate or chassis. This is provided with a hole large enough to receive the tube base. The printed lines approach the socket hole radially. The socket is eyeletted to the bottom of the chassis in registration with the hole, thus bringing the seven radial lugs of the socket beneath but bearing upwardly against the printed conductors. To insure more dependable contact a drop of solder is then applied at the end of each lug to connect the same to the printed conductor therebeneath.

It will be noted that the wafer 12 or 46 has a center hole 60. This is not essential but is provided to adapt the same to receive a so-called center shield, this being a cylindrical metallic member sometimes desired on a socket of this type. By providing the hole 60 the finished socket may be sold with or without the shield, the shield being added as a part of the assembly operation.

It is believed that the method of making, assembling and using my improved radio tube socket, as well' as the advantages thereof, will be apparent from the foregoing detailed description. It will also be understood that while I have shown and described my invention as applied to a miniature tube socket, it is not limited to such a socket, and may be used with tubes of different size. It may also be used when making sockets for other types of tubes which may have a different number or spacing of prongs. It will therefore be apparent that while I have shown and described the invention in several preferred forms, changes may be made in the structures shown, without departing from the scope of the invention, as sought to be defined in the following claims.

I claim:

1. A metal contact for a single wafer socket for miniature tubes, said contact comprising a pin-engaging portion extended at one end to provide a soldering lug, and extended and narrowed at the other end to act as an anchoring tab, said tab being bent. downwardly from the pin-engaging portion, said soldering lug being of generally conventional Width for tube sockets of the class described, said pin-engaging portion being substantially narrower than said lug, and said tab end of the contact having an overall width which is less than that of the pin-engaging portion end only a fraction of the width of the lug, and having a length suificient to pass through a single wafer with its tip adapted to be bent beneath the wafer, said pin-engaging portion having two slots and two slits and a hole to receive the tube pin, one of said slots being spaced from the hole toward the soldering lug, the other slot being spaced from the 'hole toward the tab, and said slits running longitudinally of the pin-engaging portion of the contact between the slots and the hole, and said hole being small enough to receive the tube pin with a resilient fit.

2. A metal contact for a single wafer socket for miniature tubes, said contact comprising a pin-engaging portion extended at one end to provide a soldering lug, and extended and narrowed at the other end to act as an anchoring tab, said tab and said lug being bent downwardly from the pin-engaging portion, said soldering lug being of generally conventional width for tube sockets of the class described, said pin-engaging portion being substantially narrower than said lug, and said tab end of the contact having an overall width which is less than that of the pin-engaging portion and only a fraction of the Width of the lug, andha-ving a length suflicient to pass through a single wafer with its tip adapted to be bent beneath the wafer, said pin-engaging portion having two slots and two slits and a hole to receive the tube pin, one of said slots being spaced from the hole toward the soldering lug, the other slot being spaced from the hole toward the tab, and said slits running longitudinally of the pin engaging portion of the contactbetween the slots and the hole, and said hole being small enough to receive the tube pin with a resilient fit.

3. A metal contact for a single wafer miniature tube socket for use with printed circuitry, said contact comprising a pin-engaging portion extended at one end to provide a soldering lug lying in generally the same plane as the pin-engaging portion, and extended and narrowed at the other end to act as an anchoring tab, said tab being bent downwardly from the pin-engaging portion, said soldering lug being of generally conventional width for tube sockets of the class described, said pin-engaging portion being substantially narrower than said lug, and said tab end of the contact having an overall width which is less than that of the pin-engaging portion and only a fraction of the width of the lug, and having a length sufficient to pass through a single wafer with its tip adapted to be bent beneath. the wafer, said lug having a tongue similar to the aforesaid tab excised centrally and struck downwardly from. the lug near the aforesaid pin-engaging portion, said pin-engaging portion having two slots and two slits and a hole to receive the tube pin, one of said slots being. spaced from the hole toward the soldering lug, the other slot beingspaced from the hole toward the tab, and said slits running longitudinally of the pin-engaging portion of the contact between the slots and the hole, and said hole being small enough to receive the tube pin with a resilient fit.

4. A socket for miniature tubes, said socket comprising a single wafer of insulation having three concentric rings. of holes, said holes being aligned radially and receiving a ring. of contacts, each contact comprising a pinengaging portion extended at one end to provide a soldering lug, and extended and narrowed at the other end to act asv anv anchoring tab, said soldering lug being. of generally conventional. width for tube sockets of the class described, sai'd pin-engaging portion being substantially narrower than said lug, and said tab end of the contact having an overall. width which is less than that of the pinengaging portion and only a fraction. of the width of the lug, saidv pin-engagingport ionhaving two slots and two slits and a hole to receive the tube pin, one of said slots being spaced from the hole toward the soldering lug, the other of said slots being spaced from the hole toward the tab, said slits running longitudinally of the pin-engaging portion of the contact between the slots and the hole, said hole being small enough to receive the tube pin with a resilient fit, said contacts resting on top of said wafer, the tabs being received in and passing downward through the innermost holes, the lugs being received in and passing downward through the outermost holes, the resilient pin-gripping portions being registered with the intermediate ring of holes, the free ends of said tabs being bent outwardly beneath the wafer, and an intermediate portion of said lug directly beneath the wafer being indented inwardly, to anchor said contacts to said wafer.

5. A socket for miniature tubes for use with printed circuitry, said socket comprising a single wafer of insulation having three concentric rings of holes, said holes being aligned radially and receiving a ring of contacts, each contact comprising a pin-engaging portion extended at one end to provide a soldering lug lying in generally the same plane as the pin-engaging portion, and extended and narrowed at the other end to act as an anchoring tab, said soldering lug being of generally conventional width for tube sockets of the class described, said pin-engaging portion being substantially narrower than said lug, and said tab end of the contact having an overall width which is less than that of the pin-engaging portion and only a fraction of the width of the lug, said lug having a tongue excised centrally and struck downwardly from the lug near the aforesaid pin-engaging portion, said pin-engaging portion having two slots and two slits and a hole to receive the tube pin, one of said slots being spaced from the hole toward the soldering lug, the other slot being spaced from the hole toward the tab, said slits running longitudinally of the pin-engaging portion of the contact between the slots and the hole, said hole being small enough to receive the tube pin with a resilient fit, said contacts resting on top of said wafer, the tabs being received in and passing downward through the innermost holes, the tongues being received in and passing downward through the outermost holes, the resilient pin-gripping portions being registered with the intermediate ring of holes, the free ends of said tabs being bent outwardly beneath the wafer, the free ends of said tongues being bent inwardly beneath the Wafer, and said lugs overlying said water as radial outward extensions thereof, and the ends of said lugs projecting beyond the periphery of the wafer and thereby adapting the same to be soldered to printed circuitry thereabove with the top of the socket lying against the circuitry.

References Cited in the file of this patent UNITED STATES PATENTS 1,963,792 Kimbell June 19, 1934 1,963,793 Kimbell June 19, 1934 1,997,270 Titus Apr. 9, 1935 2,017,940 Bessey Oct. 22, 1935 2,519,121 Del Camp Aug. 15, 1950 FOREIGN PATENTS 637,625 Great Britain May 24, 1950 241,517 Switzerland July 16, 1946 

